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Enhancing Quality Education in Engineering and Technology Through AI Implementation
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Author(s): M. Dhanasekar (School of Law, Vel Tech Rangarajan Dr. Sagunthala R&D Institute of Science and Technology, Chennai, India), Rijuta Prashant Joshi (School of Management, Ramdeobaba University, Nagpur, India), R. Somasundaram (Department of Management Studies, Kongu Engineering College, Perundurai, India), Kavya D. N. (Artificial Intelligence and Machine Learning, Dayananda Sagar College of Engineering, Bangalore, India), Uma Patil (Department of Computer Science and Engineering, Nutan College of Engineering and Research, Pune, India)and Subhi Boopa (Model Engineering College, India)
Copyright: 2026
Pages: 28
Source title:
Digital Transformation and Sustainability in Higher Education
Source Author(s)/Editor(s): Wan Zuhainis Saad (Universiti Putra Malaysia, Malaysia), Nor Aziah Alias (Malaysian Academy of Professors, Malaysia), Chou Min Chong (Universiti Putra Malaysia, Malaysia)and Suriana Sabri (Universiti Putra Malaysia, Malaysia)
DOI: 10.4018/979-8-3373-5077-6.ch005
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Abstract
This chapter explores the potential of artificial intelligence and data science in improving quality in education, focusing on aligning learners' needs, enhancing curriculum design, and improving assessment strategies. The chapter explains the uses of predictive analytics for identifying at-risk students, additional targeted paths for motivating the students, and AI-aided tools that foster collaborative learning. It also revises the problems and ethical concerns related to AI and data science applications in the educational context. By adopting these technologies, it will be easier for educators to create a much more engaging, open, and efficient learning environment, which is significantly better placed to help learners understand the nuances of the current learning environment in engineering and technology. This chapter aims to bolster the belief that AI and data science provide a promising avenue for enhancing engineering and technology education.
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